3D Glue Path Inspection System

The 3D Glue Path Inspection System is a core device for post-dispensing quality control. Its key function is to address the pain point that traditional 2D inspection or manual visual inspection cannot accurately control the three-dimensional quality of glue paths, by means of 3D vision scanning and quantitative data analysis, upgrading from “planar judgment” to “three-dimensional full-dimensional verification”.

Product Features

System Basic Workflow

• Material Feeding

• Visual Deviation Correction

• Precise Scanning

• 3D Reconstruction and Inspection 

• Material Discharging

3D Inspection Advantages

• Strong Anti-interference Capability

• Wide Detection Range

• High Detection Accuracy

• Digital Presentation

• Fast Programming and Operation

• Precise Point-by-point Analysis and Detection

• Long-term Historical Traceability

Introduction to 3D Pavement Inspection Process

Advantages of 3D Glue Path Inspection

Strong Anti-interference Capability

3D line laser scanning reconstructs the 3D information of the glue path based on the product's height data, and is not affected by changes in product color or angle.

Wide Detection Range

Through motion mechanisms and flexible programming, 3D inspection can cover the entire glue path without being limited by the lens field of view.

High Detection Accuracy

The line laser achieves an X-direction resolution of 0.005mm. 3D reconstruction can perform denoising and anti-interference, ensuring a stable detection accuracy of 0.02mm.

Digital Presentation

3D inspection can automatically and uniformly generate inspection points with adjustable spacing. The results are easy to save, upload, and display graphically.

Advantages of 3D Glue Path Inspection

Fast Programming and Operation

The 2D camera stitches a full product view, on which users can program the 3D scanning path. The system then automatically calculates the scanning angle in one click, for convenient and efficient operation.

Precise Point-by-Point Inspection and Analysis

Historical scanning data of designated points can be quickly imported with one click. The scanned contours are displayed intuitively and clearly, enabling precise comparison of inspection results from each scan.

Long-Term Historical Traceability

The measurement data from 3D glue path inspection is written to the disk and saved as CSV files. This method ensures stable data storage for more than half a year, providing a sufficiently long traceability cycle.

3D Glue Path Inspection User Interface Design

1、The system features efficient real-time rendering, enabling rapid generation and display of 3D point cloud models. It supports multi-angle viewing, allowing users to comprehensively and precisely observe the detailed features of the 3D point cloud.

 2、It clearly presents inspection point results along the scanning path and precisely highlights defects detected during scanning, enabling users to quickly locate and identify issues.

3、It accurately tracks productivity data for each scanning trajectory and displays real-time measurement data, allowing users to monitor scanning progress and efficiency at any time.

 4、It provides real-time monitoring of machine status, motion systems, and vision systems to ensure stable equipment operation.

3D Glue Path Inspection User Interface Design

1、Users can flexibly add or delete 3D scanning paths as needed to precisely cover target inspection areas, improving detection efficiency and accuracy.

2、Users can set custom inspection point spacing (for automatic generation) and define glue width, height, offset tolerances, and specific inspection schemes for each point.

3、Multiple inspection schemes are supported, capturing key parameters such as glue path platform height and glue position accuracy.

Application Scenarios of 3D Glue Path Inspection

Thermal Gel & Silicone

1.High-power electronic devices: 5G base station AAU modules, IGBT power modules 2.New energy vehicles: Battery Management System (BMS), motor controllers 3.Consumer electronics: Smartphone SoC heat dissipation, LED driver modules 4.Military & aerospace: Radar T/R components, satellite-borne equipment

Solder Paste

1.Electronic products: Smartphones, tablets, TWS earbuds, smartwatches 2.Automotive manufacturing: ECUs (Electronic Control Units), LED lights/sensors (high-temperature resistant applications) 3.Medical devices: Blood glucose meters, hearing aids, imaging equipment 4.Industrial & communication equipment: 5G base stations/RF modules, server room switches, industrial control motherboards
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